商品編號:DSAJ4U-A900GHZSD

威強電 WAFER-TGL-U 嵌入式單板電腦 3.5 SBC

$13,800
折價券
  • 支援獨立四顯:2 x HDMI 1.4,1 x DP 1.4,1 x iDPM
  • 高速 I/O 接口:4 x USB 3.2 gen 2 (10Gb/s)、SATA (6Gb/s)
  • 支援三個 Intel® I225V 2.5GbE 網路口,支援 M.2 A Key,B key 擴展槽
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    全盈+PAY 單筆消費滿$1,200元贈80P幣(限量)

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付款方式
出貨
  • 廠商出貨
    本商品不受24h到貨限制
配送
實際運費計算依結帳頁為準
  • 宅配到府(本島/低溫)
    滿$699免運
  • 宅配到府(本島/常溫)
    滿$490免運
  • 超商取貨(常溫)
    滿$350免運
  • 超商取貨(低溫)
    滿$699免運
  • i郵箱(常溫)
    滿$290免運
商品詳情
  • intelpartnerE WFERTGL take all the eential element of the latet 1th   eries processors and combines them withsmart manufacturing features and proven durability in the compactsize 3 form factor is ideal for spaceconstraints installation notably AutomatedGuided Vehicle AMR Autonomous Mobile Robot and smallcabinets in factories t features complete  interfaces such asthree 25  LAN ports for motion control   cameras an M2  with   for LTE cellular communication and S 32 Gen 2serial ports for connecting sensors and communicating with otherdevices     displays3   A keyH thermal design26 32 MHzDDR4 SDIMMSsupport up to 32 GBsupport e toeDVGAmodules D2  23242245 2322  SB 2ADIEnhanced  Performance4  USB  Gen22  M2 B key30522242M2 A key22303  2E LAN 6GbsWelldesign ThermalSolutionHigh SpeedTransmissionNetworking11th Gen  ore Useries WAFERTGL is a  embedded board equipped with the 11th generation  Core U processor supporting up to 4 cores 8 threads turbo upto 440  The  Core  and  processors are integrated with    9U graphics core delivering high Al inference performancefor the  th no graphics  required it can provide a costeffective industrial solution featuring low power consumption and effective heattransferCPU Benchmark Celeron 4205U  180GHz2T) Celeron 6305 180GHz 2C2T)Intel Core i38145UE  220GHz39GHz 2C/4T)Intel Core i31164E 300GHz/39GHz2C/4T)Intel Core i58365UE  1GHz/41GHz 4C/)Intel Core i51147E  2.60GHz/ 4C/8T)Intel Core 8665UE 1.70GHz/4.4GHz (4C/8T)Intel Core i71187E  2.80GHz/4.4GHz (4C/8T)Effortless UpgradeCompared with the previous generation the WAFERTGL features highperformance CPU and GPU along with Al deep learning capabilities in a compact form factor. The WAFERTGL provides effortless upgrade allowing newversion replacement to improve performance without changing the originalmechanical design.66221140577685%1029302000400060008000WAFER Generation   14CPUX11114WAFERTGL11th Generation Intel Processors 10 Supern4 simultaneous displaysTriple displaysplay    DP 14 HDMI  LVDS   card   A Epansion4  USB  Gen  5Gb/sUSB   620Learning1    3040 slot  2230 A key M.2 3052/2042 B key with SIM holder4  USB 3.2 /s   Graphics (Core i7 / ) UHD Graphics (/)0 Independent Displays with up to 4K ResolutionThe WAFERTGL  motherboard integrates the latest    graphics (Gen12) offering ma. 96  and up to 2.95 times faster graphicsperformance to deliver ecellent graphics performance. th two HDMI  (up to 4096  216030Hz) one DP 1.4 (up to 4096  2160 @60Hz) andthe option to use the  interface to support four independent displays it is ideal for video surveillance  digital signage or medicalimaging application which requires high graphics performance.Graphics Base FrequencyIntel   Graphics350Intel UHD Graphics 620Eecution UnitsIntel  Xe Graphics196Free to choose display connections with  modulesMore display I/ are supported    connector. The  display converter boards allow the WAFERTGL to meet customers diverse displayinterface requirements such as the legacy display port VGA and LVDS or eDP for TFT LCD connection.-LVDSeDP to 24-bit dual-channel LVDSconverter boardiDPM-eDPeDP to eDP converter boardDPM-VGAeDP to VGA converter boardReady for Any ScenarioThe WAFER-TGL supports up to quad independent display thus it is fleible to use in multi-display applications.  diverse display outputs offered bythe IDPM modules make the WAFER-TGL more suitable for any feasible scenario.System Digital Signage-KioskMedical Imaging000Well-design Thermal Solution has developed a highly efficient thermal solution for the  motherboard -  Heat Conduction Casing (IHCC). The IHCC can effectively improveheat transfer performance and we  keep on improving our heat sink design to ensure providing an innovative thermal solution for the industrialmarket.Diverse mounting optionsWith its well-design thurmal casing the WAFER-TGL provides  holes onthree sides. It can be installed on a control cabinet's rear panel door oronto a DIN rail. And it is easy to install additional thermal module foroperating under high ambient temperatures.The IHCC consists of a case and a heatconduction block that is made to perfectlyfit with the CPU to achieve heat transfer.tting different mounting needsA. Embedded SystemB. Electrical CabinetC. Fleible Thermal  Stacking ModulePassive ( -WAFER-WF-R10)High Speed TransmissionUSB 3.2 Gen2USB 3.2 Gen110 Gb/s5 Gb/s Faster 6 Provides700600500faster transfer speeds400300300Twice as fast data processing it is capable of delivering lightningfast data transfer eperience for edge Al data process200applications.100ptioinalActive Cooling Module(P/N CM-WAFER-WF-R10)Four USB 3.2 Gen 2(10Gb/s)Four USB 3.2 Gen 2 (10 Gb/s) ports are integrated to support highdensity data transmission.60020MB/sSATA 3Gb/sSATA 6Gb/sNetworkingFasterDelivers Triple Low-LatencyG LAN Powered by IntelThe on-board triple    controllers enable theWAFER-TGL to meet the bandwidth-intensive requirements such aslarge file transfers and high-resolution video streaming.Gigabit LAN Wi-Fi 6EG LAN25 GbpsM.2 3042 B Key with SIMSlot for 4G LTE CellularCommunicationThe M.2 3042 B key connector supporting PCI Gen3 2 and USB  signalsallows you to use a dedicated LTE radio frequency to ensure secure anddelay-free data transmission in smart manufacturing.For any 5G requirements please contact  for support.Wi-Fi 6E0187DM.2 2230 A KeyM.2 2230 A Key forWi-Fi/BluetoothThe M.2 2230 A key slot carrying with  Gen3 1 and USB 2.0signals allows it to adopt the latest Wi-Fi 6E technology.Wi-Fi 6E enhances low latency and supports service levels that areequivalent to  networks.6 GHZ5 GHz GHzDimensions (Unit mm)1572011021.74   146SpecificationsHardware Spec.SystemCPUMemoryMemory Ma.11th Gen. Intel® mobile Tiger Lake-UP3 on board processorIntel® Core i7-1185G7E (up to 4.4GHz quad-core 12M Cache TDP-28/15/12W)Intel® Core  (up to  quad-core 8M Cache TDP-28/15/12W)Intel® Core i3-1115G4E (up to 3.9GHz dual-core 6M Cache TDP-28/15/12W)Intel® Celeron® 6305 (up to  dual-core 4M Cache TDP-15W)Intel® Celeron®  (up to 1.8GHz dual-core 4M Cache TDP-15W)ne 260- 3200 MHz DDR4 - support up to 32 GBup to 32GBCooling method/ System Fan1  System fan connector (14 pin P2.54)StorageStorageI/O InterfaceDisplay Output1  SATA 6Gb/s with  SATA power connector2  HDMI up to 4096  2160@30Hz1  Display Port up to 4096  2160@60Hz1  IDPM  IDPM 3040 slot (only for  eDP/LVDS/VGA module)Ethernet LAN-AudioLAN1 Intel®   controllerLAN2 Intel®   controllerLAN3 Intel® 1225V 2.5 controller1 x HD Audio 1 x IAUDIO support  AC-KIT-888S Audio Module (2 x 5 pin)I/O Interface1 x Internal RS-232  pin P2.02 x Internal RS-232/422/4852x5 pin P-2.00 RS-485 support AFC2 x Internal USB 2.0: 2x4 pin P2.001 x DIO: 12-bit digital I/O (2x7 pin P2.0)4 x External USB 3.2 Gen2 : 10Gb/sExpansion2 x M.2 NGFF)Other FeaturesTPMPowerPower SupplyEnvironment1 x M.2 A key (2230) with  Gen3 x1/USB 2.01 x M.2 B Key (2242/3052) for 5G with  Gen3 x2/USB 2.0Intel® PTT(TPM 2.0) DC  power (AT/ATX mode)Operating Temperature0C-60CStorage TemperatureHumidity-20C -70C5%% non-condensingCertificationsSafety & EMCCE/FCC compliant®OOrdering InformationWAFER-TGL-U-17-R10 SBC with Intel® Tiger Lake-UP3 Core  ProccessorDDR4 -DIMM DC inputDisplayTriple M.2 with A/B keyTriple Intel® 2.5 SATA WAFER-TGL-U-15-R10 SBC with Intel® Tiger Lake-UP3 Core  ProccessorDDR4 -DIMM12V DC inputQuadDisplay Triple M.2 with A/B keyTriple Intel® 2.5 SATAWAFER-TGL-U-13-R10 SBC with Intel® Tiger Lake-UP3 Core i3-1115G4E Proccessor DDR4 SO-DIMM12V DC inputQuadDisplay Triple M.2 with A/B keyTriple Intel® 2.5 ,SATA, USB3.2,,WAFER-TGL-U-C-R103.5 SBC with Intel® Tiger Lake-UP3 Celeron® 6305 Proccessor,DDR4 SO-DIMM,12V DC input,Quad Display, Triple Intel® 2.5 GbE,SATA,USB3.2,M.2,,WAFER-TGL-U-CE-R103.5 SBC with Intel® Tiger Lake-UP3 Celeron 6305E Proccessor,DDR4 SO-DIMM,12V DC input,Quad Display, Triple M.2 with A/B key,Triple Intel® 2.5 GbE,SATA, USB3.2,,Package ContentsPackage Content 1 x WAFER-TGL-U single board computer1 x SATA cable 1 x I/O shielding- 1 x

規格說明
標準配備
1 x WAFER-TGL-U 嵌入式單板電腦 1 x SATA 線材 1 x I/O 檔片 1 x QIG
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